PostProcess DEMI 800


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Industrial support and resin removal

The PostProcess DEMI 800 removes additional resin or PolyJet and FDM carriers using PostProcess' patented Submersed Vortex Cavitation (SVC) technology. Using a moving flow and "sink-float" technique, the SVC technology efficiently removes PolyJet and FDM carriers.

Fast and consistent removal is achieved through alternating motion combined with best-in-class energy delivery and detergent filtration. The PostProcess DEMI 800 purge algorithms regulate the movement of fluids in the machine and adjust sensor data in real-time to prevent part damage and ensure consistent carrier and resin removal.


Basin size: 460 x 460 x 460 mm.

Consumable capacity: 151 liters

Variable temperature: 30-63°C

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