PostProcess DEMI400


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Industrial support and resin removal

For SLA, CLIP and DLP technologies, the PostProcess™ DEMI 400™ Support & Resin Removal Submersion Device enables automatic removal of PolyJet and FDM supports and excess resin.

PostProcess Technologies' Submersed Vortex Cavitation (SVC) technology is already integrated in the DEMI 400 version to ensure a uniform cleaning effect. The DEMI 400 provides a precise, automated post-process solution for additive manufacturing operations. A uniquely,e software-controlled process control in conjunction with special cleaning agents, ensures highly efficient cleaning of components.

Technical data:

Basin size: 355 x 355 x 355 mm.

Capacity for consumables: 64 liters

Variable temperature: 30-63°C

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