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A GROUNDBREAKING UV-CURABLE MATERIAL FOR DLP PRINTING
ATARU™ is engineered for exceptional hightemperature resistance and durability. ATARU™ also delivers excellent surface quality along with incredibly low dielectric loss.
This material offers market-leading thermal performance and durability, signal integrity assurance thanks to unique low dielectric loss property, as well as low viscosity to ensure wide compatibility with different DLP printers.
Key Benefits:
- High thermal performance and durability
- High impact strength
- Ultra low dielectric loss
- Excellent surface quality
- Fast processing
Ideal Applications:
- Injection Molding
- Molding under high pressure & temperature (carbon fiber molding)
- Tooling & fixtures
- Serial production (high speed curing time)
- Radio frequency RF (antenna)
Mechanical Properties
| Property | Standard | Value |
| Tensile Modulus | ISO 527-1/-2 | 5,640 MPa |
| Stain at Break | ISO 527-1/-2 | 1.9 % |
| Stress at Break | ISO 527-1/-2 | 73 % |
| Flexural Modulus | ISO 178 | 5,360 MPa |
| Flexural Strength | ISO 178 | 127 MPa |
| Flexural Strain at Break | ISO 178 | 2.7 % |
| Izod Impact Strength (unnotched) | ASTM D4812 : 2006 | 236 J/m |
Thermo-mechanical Properties
| Property | Standard | Value |
| CTE (0°C to 110°C) | IPC-TM-650 2.4 24.5 | 45.0 µm/(m∙K) |
| CTE (110°C to 200°C) | IPC-TM-650 2.4 24.5 | 72.6 µm/(m∙K) |
| CTE (200°C to 300°C) | IPC-TM-650 2.4 24.5 | 116.3 µm/(m∙K) |
| Td2 | IPC-TM-650 | 351 °C |
| Td5 | IPC-TM-650 | 378 °C |
| Tg | IPC-TM-650 | >300 °C |
| HDT/B (0.45 MPa) | ISO 75-2:2013-08 | >300 °C |
| HDT/A (1.8 MPa) | ISO 75-2:2013-08 | >300 °C |
| HDT/C (8.0 MPa) | ISO 75-2:2013-08 | 133 °C |
Thermal Properties
| Property | Standard | Value |
| Thermal Conductivity (25 °C) | - | 0.28 W/mK |
| Thermal Conductivity (50 °C) | - | 0.29 W/mK |
| Thermal Conductivity (100 °C) | - | 0.31 W/mK |
| Spec. Heat Capacity (23 °C) | - | 0.97 J/gK |
| Spec. Heat Capacity (200 °C) | - | 1.5 J/gK |
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